Semiconductor Packaging Equipment Supplier & Manufacturer

Sourcing compact equipment in bulk is now easier and more affordable. Suntech Advanced Ceramics (Shenzhen) Co., Ltd. is your semiconductor packaging equipment supplier. With years of industry experience and ISO-certified manufacturing facilities, we specialize in high-precision ceramic and tungsten-based packaging solutions for demanding applications. Our packaging solutions support applications requiring optimal thermal conductivity, and dimensional tolerances within ±0.01mm.

Custom Semiconductor Packaging

Our custom solutions maintain consistent performance across high-volume production runs, backed by comprehensive quality testing. Whether it is wire-bonding production or any other sensitive application, we have what you need. Our custom production is available for factories and retailers. 

Semiconductor Packaging with A1-Grade Ceramic and Tungsten 

The electronic and mechanical devices will perform at peak efficiency. It is about the excellent dielectric performance our packaging offers. Likewise, you will get A1-grade ceramic and tungsten in each batch of production. Our packaging solutions deliver critical performance advantages:

• Enable precise wire packaging.
• Rated for continuous operation up to 400°C in demanding environments.
• Include high crack resistance against shocks and vibrations.
• Ensure secure die attachment and thermal interface stability through superior adhesion
• Feature optimal electric resistance for industrial applications.

Technical Specifications

Our ceramic packaging components feature dielectric constants ranging from 9.0 to 10.0, with thermal expansion coefficients matched to silicon substrates. Tungsten metallization layers provide excellent hermetic sealing for moisture-sensitive applications, meeting MIL-STD-883 requirements for reliability testing.

Fulfilling Demands as a Semiconductor Packaging Equipment Manufacturer

We maintain production capacity to fulfill high-volume industrial requirements with lead times of several weeks for standard configurations. The electronic, automotive, aerospace, and electrical industries should contact us. We manufacture to the precise specifications required for high-functioning devices across these industries.

Fully Compatible Custom Semiconductor Packaging Solutions

These solutions enable precise installation of MEMS devices and secure chip mounting in PCB assemblies, ensuring optimal electrical and thermal performance. Our packaging systems accommodate various form factors and are compatible with standard industry mounting configurations and automated assembly processes.

Why You Need A Semiconductor Packaging Supplier

The quality will be consistent, along with timely service. With dedicated technical support to assist in specification matching and application engineering, our team will assist you in order placement and timely updates. You can contact our team to provide the design and features you want in semiconductor packaging. Additionally, we offer competitive pricing for large-scale orders with global shipping capabilities and flexible delivery schedules.