Tungsten Capillary (Wedge Shape Capillary）

Materials:

It is made up of Tungsten carbide (hard alloy), Titanium carbide.

Features:

· Tungsten Capillary is used for the main process of IC packaging - aluminum (wire) bonding. 

· Wedge tungsten capillaries highly beneficial for applications where precision, reliability, and minimal wear are crucial, such as in high-frequency or high-performance semiconductors.

· The wedge shape allows for more precise force control when bonding delicate wires, crucial in applications like MEMS (MicroElectroMechanical Systems) and microelectronics.

· The capillary’s shape helps in ensuring uniform heat application during thermosonic bonding, reducing the risk of wire breakage or poor-quality bonds.

Application:

Commonly used wire bonding welding methods include Thermocompression welding, Ultrasonic welding and Ultrasonic thermocompression welding.