Spring Collet

Materials

 Ceramic + Stainless steel. 

Features 

• High Precision: Provides precise, uniform clamping force to secure components during the semiconductor packaging process, ensuring accurate alignment and minimal risk of misplacement.
• Spring Action: The integrated spring mechanism allows for adjustable tension, making it adaptable to different die sizes, shapes, and bonding techniques.
• Thermal Stability: Withstands the temperature fluctuations associated with semiconductor packaging processes, such as die attach and wire bonding, without deforming or losing effectiveness.
• Vibration Resistance: Reduces vibration during the bonding process, which is critical for ensuring the stability of micro-sized components and achieving high-quality bonds.
• Compact and Lightweight: Designed to fit into small, precise machinery used in the semiconductor packaging process, making it ideal for high-volume, automated production lines. 

Application

Die bonding process, Wire Bonding, flip-chip bonding and MEMS packaging , High-Precision Electronics such as in LED.