Die Bonding Collets

Material

 Zirconia, Silicon carbide (Sic), Tungsten carbide & SUS .

Features and Benefits 

· Tungsten Steel is known for its exceptional hardness and resistance to wear and tear, making it ideal for high-precision applications like semiconductor packaging, where tools undergo constant mechanical stress and high temperatures during wire bonding.

· This material can withstand the high forces, vibrations, and ultrasonic energy involved in the wire bonding process without    significant wear, ensuring consistent performance over time.

· Tungsten steel collets help in achieving tight tolerances, which is essential in semiconductor packaging, where the bonding wire must be placed accurately on micro-sized pads.

· In wire bonding, especially ultrasonic bonding, reducing vibration in the bonding tool is critical to achieve precise bonding. 

Applications

Used in Semiconductor die attach process, COB packaging, MEMS.