The rapid growth of power electronics in sectors from consumer devices to military equipment has increased the need for efficient packaging solutions. Alumina substrates are widely used as substrates due to their excellent dielectric constant, high dielectric strength, low dielectric loss, good thermal stability, and high mechanical strength.
Alumina substrates are ceramic platforms made from aluminum oxide (Al₂O₃). They are valued in electronics for their thermal conductivity, electrical insulation, mechanical strength, and chemical stability. These substrates are often used as a base for mounting electronic components due to their ability to withstand high temperatures and provide a reliable electrical interface. Metallization involves applying a metal layer to these non-conductive ceramics, enabling strong electrical and mechanical bonding with metal parts that is essential for device reliability. However, since alumina cannot be directly welded to metals, metallization is essential to bond ceramic and metal layers effectively.
Application:
Semiconductor Industry
Telecommunications
Medical Devices
LEDs and Optoelectronics
Sensors and Actuators
Power Electronics